KSG-5

Semiconductors support our convenient lives.
However, it is also true that materials with high environmental impacts are used in their production. How can we protect both daily convenience and the environment?

KSG-5 is an etching gas with a low environmental impact that can support both semiconductor manufacturing and our lives.

Etching Performance

KSG-5 has etching performance equivalent to CF4 and CHF3 for silicon-containing films, while also having the ability to suppress etching of mask materials.

Etching performance (evaluated by KDK using blanket wafers)

Gas flow rate Etching Gas/Ar /O2 = 20 / 50 / 0 ~ 10 sccm
Pressure 10 Pa
Plasma output 300 W (single-frequency)
Etching time 1 min

Environmental Performance

Contribution to CO2 Emissions Reduction

With its overwhelmingly low GWP compared to CF4 and CHF3, KSG-5 can significantly reduce greenhouse gases derived from process gases emitted from semiconductor manufacturing processes.

*Calculated using the calculation method described in IPCC Chapter 6 “ELECTRONICS INDUSTRY EMISSIONS” for the results of our own process gas analysis.
**CO2e of CHF3 is set to 100