Semiconductors support our convenient lives.
However, it is also true that materials with high environmental impacts are used in their production. How can we protect both daily convenience and the environment?

KSG-5 is an etching gas with a low environmental impact that can support both semiconductor manufacturing and our lives.
Etching Performance
KSG-5 has etching performance equivalent to CF4 and CHF3 for silicon-containing films, while also having the ability to suppress etching of mask materials.
Etching performance (evaluated by KDK using blanket wafers)
| Gas flow rate | Etching Gas/Ar /O2 = 20 / 50 / 0 ~ 10 sccm |
|---|---|
| Pressure | 10 Pa |
| Plasma output | 300 W (single-frequency) |
| Etching time | 1 min |
Environmental Performance
Contribution to CO2 Emissions Reduction
With its overwhelmingly low GWP compared to CF4 and CHF3, KSG-5 can significantly reduce greenhouse gases derived from process gases emitted from semiconductor manufacturing processes.
**CO2e of CHF3 is set to 100